Benefits
Patented Thermal Core Technology
Optimized thermal heat transfer to
the solder joint. Consistent soldering
for reduced rework.
MIL-SPC / IPC standard Reduces risk
of damage to sensitive components
and workpieces. No rework, lower
total cost of ownership
Active tip technology Fastest heat-up
and recovery time, sensor close to the
solder tip, excellent heat transfer. No
downtime, continuing workflow,
excellent results
Digital tool for data storage Motion
activated usage sensor for energy
control and data storage
Patented tip & grip design Only
soldering tip on the market which can
be changed without a tool. 20% faster
change than leading competitors.