1 Features
• Radiation tolerant:
– Single-event latch-up (SEL) immune up to
LET = 43 MeV-cm2/mg at 125°C
– Single-event functional interrupt (SEFI)
characterized up to LET = 43 MeV-cm2/mg
– Total ionizing dose (TID) RLAT/RHA
characterized up to 20 krad(Si)
• Space-enhanced plastic (space EP):
– Meets ASTM E595 outgassing specification
– Vendor item drawing (VID) V62/22614
– Military temperature range: –55°C to +125°C
– One fabrication, assembly, and test site
– Gold bond wire, NiPdAu lead finish
– Wafer lot traceability
– Extended product life cycle
– Extended product change notification
• 12 monotonic, 12-bit DACs
– 0 V to 5 V output range
– DAC shutdown to user-defined level
• 16 input, 12-bit SAR ADC
– High sample rate: 500 kSPS
– 16 single-ended inputs or
2 differential and 12 single-ended inputs
– Programmable out-of-range alarms
• 8 GPIO pins
• Internal 2.5-V reference
• Two remote temperature sensors
• Internal temperature sensor
• Configurable SPI and I2C interface
– 2.7-V to 5.5-V operation

2 Applications
• Command and data handling (C&DH)
• Communications payload
• Radar imaging payload
• Optical imaging payload
• General analog monitoring and control

3 Description
The AFE11612-SEP is a highly integrated analog
monitor and control device designed for high-density,
general-purpose monitor and control systems. The
device includes 12 12-bit digital-to-analog converters
(DACs) and a 16-channel, 12-bit, analog-to-digital
converter (ADC). The device also incorporates
eight general-purpose inputs and outputs (GPIOs),
two remote temperature sensor channels, and a local
temperature sensor channel.
The device has an internal 2.5-V reference that
sets the DAC to an output voltage range of
0 V to 5 V. The device also supports operation
from an external reference. The device supports
communication through both SPI-compatible and I2Ccompatible
interfaces.
The device high level of integration significantly
reduces component count and simplifies closed-loop
system design, thus making the device a great choice
for high-density applications where radiation-tolerance
and board space are critical.