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SC-SERIES Scheda tecnica (PDF) - Skyworks Solutions Inc.

SC-SERIES Datasheet PDF - Skyworks Solutions Inc.
Il numero della parte SC-SERIES
Scarica  SC-SERIES Scarica
Grandezza file   161.87 Kbytes
Page   5 Pages
Produttore elettronici  SKYWORKS [Skyworks Solutions Inc.]
Homepage  http://www.skyworksinc.com
Logo SKYWORKS - Skyworks Solutions Inc.
Spiegazioni elettronici MIS Chip Capacitors

SC-SERIES Datasheet (PDF)

Go To PDF Page Scarica Scheda tecnica
SC-SERIES Datasheet PDF - Skyworks Solutions Inc.

Il numero della parte SC-SERIES
Scarica  SC-SERIES Click to download

Grandezza file   161.87 Kbytes
Page   5 Pages
Produttore elettronici  SKYWORKS [Skyworks Solutions Inc.]
Homepage  http://www.skyworksinc.com
Logo SKYWORKS - Skyworks Solutions Inc.
Spiegazioni elettronici MIS Chip Capacitors

SC-SERIES Scheda tecnica (HTML) - Skyworks Solutions Inc.


SC-SERIES Dettagli del prodotto

Features
• Readily available from stock
• High reliability silicon oxide-nitride dielectric
• Low loss: typically 0.04 dB in a 50 Ω system
• Operation through 26 GHz
• Wide temperature operation

Description
Skyworks Metal Insulator Silicon (MIS) chip capacitors are available in a wide range of sizes and capacitance values. The devices have a dielectric composed of thermally grown silicon dioxide over which a layer of silicon nitride is deposited. This dielectric has a low temperature coefficient of capacitance and very high insulation resistance. The MIS chip capacitors also exhibit excellent long-term stability, which makes them suitable for high-reliability applications. The capacitors have a high dielectric breakdown, which permits the use of thin dielectrics resulting in large capacitance per unit area. The temperature coefficient is less than 50 ppm/°C, allowing the capacitors to operate from –65 °C up to 200 °C. Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q and an insertion loss of 0.04 dB in a 50 Ω system. Insulation resistance is greater than 105 MΩ. To accommodate high volume, automated assembly methods, wafers can be supplied on expanded film frames. To reduce cost, chips can be supplied packaged in vials with sample testing only. Packaging in waffle packs with 100 percent electrical testing and visual inspection is also available.




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