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MFS2302BMBA0EP Scheda tecnica (PDF) - NXP Semiconductors

MFS2302BMBA0EP Datasheet PDF - NXP Semiconductors
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Grandezza file   2461.49 Kbytes
Page   230 Pages
Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors
Spiegazioni elettronici Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers

MFS2302BMBA0EP Datasheet (PDF)

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MFS2302BMBA0EP Datasheet PDF - NXP Semiconductors

Il numero della parte MFS2302BMBA0EP
Scarica  MFS2302BMBA0EP Click to download

Grandezza file   2461.49 Kbytes
Page   230 Pages
Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors
Spiegazioni elettronici Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers

MFS2302BMBA0EP Scheda tecnica (HTML) - NXP Semiconductors


MFS2302BMBA0EP Dettagli del prodotto

Features and benefits
Operating modes
• Normal mode with all power management and functional safety features available
• Stop mode: Low-power OFF mode with multiple wake-up sources (LPOFF)
• Standby mode: Low-power ON mode with HVBUCK or HVLDO1 active and multiple wake-up sources (LPON)
Power management
• HVBUCK: Synchronous buck converter with integrated FETs. Configurable Normal mode output voltage and LPON mode output voltage
(3.3 V or 5.5 V). Output DC current capability of 600 mA in Normal mode, and 100 mA current capability in Low-power ON mode
• HVLDO1: High-voltage LDO instead of the HVBUCK for MCU supply with selectable output voltage (3.3 V or 5.5 V) and up to 100 mA
DC current capability with internal PMOS and 250 mA with external PNP
• HVLDO2: High-voltage LDO regulator for system loads, with optional external protection for off-board sensors, selectable output voltage
(3.3 V or 5.0 V) and up to 100 mA DC current capability
• HVLDO3: High-voltage LDO regulator for CAN FD block supply or other with selectable output voltage (3.3 V or 5.0 V) and up to 150
mA current capability
System features
• One CAN FD supporting up to 5 Mbps communication following ISO 11898-2:2016 and SAE J2284 standards
• One LIN following LIN 2.2, ISO 17987-4 and SAE-J2602-2 standards
• Two wake-up inputs (40 V capable)
• Two high-voltage I/Os with wake-up capability (40 V capable)
• Up to four low-voltage I/Os with wake-up capability
• Four configurable high-side drivers with 150 mA drive capability, to supply LEDs or enable external devices (INH), and cyclic-sense
capability
• Multiple wake-up sources: WAKE pins, HVIO pins, LVIO pins, CAN FD, LIN or dedicated SPI / I2C command
• Device control via 32 bits SPI interface or via I2C interface, with CRC
• Integrated long duration timer (LDT) for system shutdown and wake-up control, programmable up to 194 days
• 16-channel analog multiplexer (AMUX) for system monitoring (temperature, battery voltage, internal voltages)
Functional safety
• Developed following ISO 26262:2018 standard to fit for ASIL B applications
• Internal monitoring circuitry with its own reference
• Additional input for external voltage monitoring
• Window or timeout watchdog function to monitor the MCU failures by software
• FCCU inputs to monitor MCU failures by hardware
• Analog built-in self-test (ABIST) on demand
• Safety outputs (RSTB, FS0B, LIMP0 and LIMP1/2 with 1.25 Hz or 100 Hz PWM capability)
EMC compliance
• The FS23 EMC tests are performed according to ZVEI Generic IC EMC Test Specification version 2.1 (2017) and FMC1278
Electromagnetic Compatibility Specification for Electrical/Electronic Components and subsystems version 3.0 (2018).
• CAN EMC performances certified against IEC62228-3:2019 and SAE J2962-2:2019
• LIN EMC performances certified against IEC62228-2:2016 and SAE J2962-1:2019
Configuration and enablement
• QFN48EP: QFN 48 pins with exposed pad for optimized thermal management, wettable flanks, 7 x 7 x 0.85 mm, 0.5 mm pitch, 48 pins
• One-time programmable (OTP) memory for scalability, expandability and device customization
• OTP emulation mode for system development and evaluation

Applications
• Body control module
• HVAC
• Lighting
• Steering column lock
• Seat module
• Roof module
• Door control module
• Car access
• Gearshift
• Seat belt pre-tension
• Tail gate
• Alarm




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A proposito di NXP Semiconductors


NXP Semiconductors è un'azienda multinazionale quotata in borsa che progetta, sviluppa e produce una vasta gamma di semiconduttori e circuiti integrati per varie applicazioni, tra cui mercati automobilistici, industriali, di comunicazione e di consumo.

La società è stata fondata nel 2006 ed è con sede a Eindhoven, nei Paesi Bassi.

NXP offre un ampio portafoglio di prodotti, tra cui microcontroller, microprocessori, ICS di autenticazione sicuri, ICS di gestione dell'alimentazione, RF e componenti a microonde e soluzioni di sensori, tra gli altri.

I prodotti dell'azienda sono progettati per essere efficienti dal punto di vista energetico, sicuri e affidabili e sono utilizzati in una varietà di applicazioni, tra cui sistemi automobilistici, automazione e controllo industriali, case intelligenti ed edifici e dispositivi connessi.

NXP è dedicato all'innovazione e alla soddisfazione dei clienti e si impegna a fornire ai propri clienti le migliori soluzioni per semiconduttori per soddisfare le loro esigenze.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.




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