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ETCSP Scheda tecnica (PDF) - Amkor Technology

ETCSP Datasheet PDF - Amkor Technology
Il numero della parte ETCSP
Scarica  ETCSP Scarica
Grandezza file   148.67 Kbytes
Page   2 Pages
Produttore elettronici  AMKOR [Amkor Technology]
Homepage  http://www.amkor.com
Logo AMKOR - Amkor Technology
Spiegazioni elettronici the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datasheet (PDF)

Go To PDF Page Scarica Scheda tecnica
ETCSP Datasheet PDF - Amkor Technology

Il numero della parte ETCSP
Scarica  ETCSP Click to download

Grandezza file   148.67 Kbytes
Page   2 Pages
Produttore elettronici  AMKOR [Amkor Technology]
Homepage  http://www.amkor.com
Logo AMKOR - Amkor Technology
Spiegazioni elettronici the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Scheda tecnica (HTML) - Amkor Technology




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A proposito di Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.




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