CFP15 Scheda tecnica(PDF) - Amkor Technology

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CFP15 Scheda tecnica (PDF) - Amkor Technology

CFP15 Datasheet PDF - Amkor Technology


Il numero della parte	CFP15

Scarica	CFP15 Scarica

Grandezza file	593.78 Kbytes

Page	2 Pages

Produttore elettronici	AMKOR [Amkor Technology]

Homepage	http://www.amkor.com

Logo

Spiegazioni elettronici

The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Datasheet (PDF)

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Scarica Scheda tecnica

CFP15 Datasheet PDF - Amkor Technology


Il numero della parte	CFP15

Scarica	CFP15 Click to download

Grandezza file	593.78 Kbytes

Page	2 Pages

Produttore elettronici	AMKOR [Amkor Technology]

Homepage	http://www.amkor.com

Logo

Spiegazioni elettronici	The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Scheda tecnica (HTML) - Amkor Technology

CFP15 Datasheet HTML 1Page - Amkor Technology

CFP15 Datasheet HTML 2Page - Amkor Technology

CFP15 Dettagli del prodotto

FEATURES
Cu connector structure to reduce inductance and resistance
Enhanced thermal properties
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Application
With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications.
Schottky Barrier Diodes (SBDs)
Rectifier & Zener Diodes
Transient Voltage Suppressors (TVS)
MOSFETs

Codice articolo simile - CFP15

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Descrizione simile - CFP15

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Xilinx, Inc	XC3000L	51Kb / 8P	Part of the ZERO family of 3.3 V FPGAs
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ams AG	KWDMLN34.EC	1Mb / 23P	This compact LED device is part of the SYNIOS P2720 family. Version 1.1 2020-07-30
	KWDMLS33.SG	1Mb / 25P	KW DMLS33.SG is part of the SYNIOS P2720 family. Version 1.7 2023-03-07
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A proposito di Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.

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