FEATURES
5 x 5 mm to 20 x 20 mm body size with 1.0 mm body height
32-176 lead counts
Broad selection of die pad sizes available
Pre-plated frames available
Inverted pad configuration available
Custom leadframe design available
Cu, Au and Ag wire options
Pb-free and RoHS compliant materials

APPLICATIONS
Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers.
TQFP packages are particularly well suited for electronic systems applications requiring broad performance characteristics, including computing, video/ audio, telecommunications, data acquisition, communication boards (ethernet, ISDN, etc.), set-top box and automotive.