| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 Advantech Co., Ltd. |
SOM-C350
|
460Kb / 2P |
Intel® 12th Gen Core Processors (Code Name: Alder Lake S) COM-HPC® Client Size C Module
29-Jul-2022 |
|
SOM-D580
|
4Mb / 6P |
Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D
17-Aug-2022 |
|
SOM-DH3000
|
310Kb / 2P |
Development Board for COM-HPC Client Pinout Modules
7-Jun-2022 |
|
SOM-DH5000
|
305Kb / 2P |
Development Board for COM-HPC Server Pinout Modules
26-May-2022 |
|
SOM-DH7000
|
483Kb / 2P |
Development Board for COM-HPC® Server Proprietary Pinout Modules
21-Jun-2022 |
|
SOM-E780
|
4Mb / 6P |
AMD EPYC™ 7003 Processor COM-HPC® Server Size E module with proprietary pinout
15-Jun-2022 |
 AAEON Technology |
HPC-ADSC.HPC-RPSC
|
530Kb / 2P |
COM HPC Client Size C with 12th/13th Generation Intel® Core™ Platform
2023/04/19 |
|
MAX-Q670A
|
734Kb / 2P |
MAX with 12th/13th Generation Intel® Core™ LGA1700 Socket Processors, TDP Max. 125W
2023/05/10 |
|
NANOCOM-KBU
|
668Kb / 2P |
COM Express Type 10 with 7th Generation Intel® Core™ U Series Processor
2022/11/24 |
|
NANOCOM-TGU
|
416Kb / 2P |
COM Express Type 10 with 11th Generation Intel® Core™ Processor
2022/12/05 |