Features
■ For surface mounted applications in order to optimize board space
■ Low profile package
■ Built-in strain relief
■ Glass passivated junction
■ Low inductance
■ Excellent clamping capability
■ 1000W peak pulse power capability at 10/1000μs waveform,
repetition rate (duty cycle): 0.01%
■ Fast response time
■ Typical IR less than 1μA above 12V
■ High Temperature soldering: 260℃/10 seconds at terminals
■ Plastic package has underwriters laboratory flammability 94V-0
■ Meets MSL level 1, per J-STD-020
■ IEC61000-4-2 ESD 30KV Air, 30KV contact compliance
Mechanical Data
■ Case: JEDEC DO-214AA. Molded plastic over glass passivated junction
■ Terminal: Tin plated, solderable per MIL-STD-750, Method 2026
■ Polarity: Color band denotes cathode except bi-directional models
■ Standard Packaging: 12mm tape (EIA STD RS-481)
■ Weight: 0.10g
Applications
■ I/O interface ■ AC/DC power supply
■ Low frequency signal transmission line (RS232, RS485, etc.)