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R7FA8D1AFECBD Scheda tecnica (PDF) - Renesas Technology Corp

R7FA8D1AFECBD Datasheet PDF - Renesas Technology Corp
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Produttore elettronici  RENESAS [Renesas Technology Corp]
Homepage  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp
Spiegazioni elettronici High-performance 480 MHz Arm® Cortex®-M85 core with HeliumTM, up to 2 MB code flash memory with Dual-bank, background and SWAP operation, 12 KB Data flash memory, and 1 MB SRAM with Parity/ECC.

R7FA8D1AFECBD Datasheet (PDF)

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R7FA8D1AFECBD Datasheet PDF - Renesas Technology Corp

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Grandezza file   2614.35 Kbytes
Page   192 Pages
Produttore elettronici  RENESAS [Renesas Technology Corp]
Homepage  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp
Spiegazioni elettronici High-performance 480 MHz Arm® Cortex®-M85 core with HeliumTM, up to 2 MB code flash memory with Dual-bank, background and SWAP operation, 12 KB Data flash memory, and 1 MB SRAM with Parity/ECC.

R7FA8D1AFECBD Scheda tecnica (HTML) - Renesas Technology Corp


R7FA8D1AFECBD Dettagli del prodotto

Features
R01DS0416EJ0120
Rev.1.20
Nov 22, 2024
■ Arm® Cortex®-M85 core with HeliumTM
● Armv8.1-M architecture profile
● Armv8-M Security Extension
● Maximum operating frequency: 480 MHz
● Memory Protection Unit (Arm MPU)
– Protected Memory System Architecture (PMSAv8)
– Secure MPU (MPU_S): 8 regions
– Non-secure MPU (MPU_NS): 8 regions
● SysTick timer
– Embeds two Systick timers: Secure and Non-secure instance
– Driven by CPUCLK or MOCO divided by 8
● CoreSight™ ETM-M85
■ Memory
● Up to 2 MB code flash memory
● 12 KB data flash memory (100,000 program/erase (P/E) cycles)
● 1 MB SRAM including 128 KB of TCM
■ Connectivity
● Serial Communications Interface (SCI) × 6 , up to 60 Mbps
– Asynchronous interfaces
– 8 bit clock synchronous interface
– Smart card interface
– Simple IIC
– Simple SPI
– Manchester coding (SCI0)
– Simple LIN (SCI0, SCI1)
● I
2C bus interface (IIC) × 2
● I
3C bus interface (I3C)
● Serial Peripheral Interface (SPI) × 2, up to 60 Mbps
● Octal Serial Peripheral Interface (OSPI)
● USB 2.0 Full-Speed Module (USBFS)
● USB 2.0 High-Speed Module (USBHS)
● CAN with Flexible Data-rate (CANFD) × 2
● Ethernet MAC/DMA Controller (ETHERC/EDMAC)
● SD/MMC Host Interface (SDHI) × 2
● Serial Sound Interface Enhanced (SSIE) × 2
■ Analog
● 12-bit A/D Converter (ADC12) × 2
● 12-bit D/A Converter (DAC12) × 2
● High-Speed Analog Comparator (ACMPHS) × 2
● Temperature Sensor (TSN)
■ Timers
● General PWM Timer 32-bit (GPT32) × 8
● General PWM Timer 16-bit (GPT16) × 6
● Low Power Asynchronous General Purpose Timer (AGT) × 2
● Ultra-Low-Power Timer (ULPT) × 2
■ Security and Encryption
● Renesas Secure IP (RSIP-E51A)
– Symmetric cryptography: AES
– Asymmetric cryptography: RSA, ECC
– Message digest computation: HASH
– 128 bit unique ID
● Arm® TrustZone®
– Up to two or four regions for the code flash, depending on the
bank mode
– Up to two regions for the data flash
– Up to two regions for the SRAM
– Individual Secure or Non-secure security attribution for each
peripheral
● Privileged control
● Device lifecyle management
● Secure boot
● Decryption on-the-fly (DOTF)
● Pin function
– Up to three tamper-resistant pins
– Secure pin multiplexing
■ System and Power Management
● Low power modes
● Battery backup function (VBATT)
● Realtime Clock (RTC) with calendar and VBATT support
● Event Link Controller (ELC)
● Data Transfer Controller (DTC)
● DMA Controller (DMAC) × 8
● Power-on reset
● Programable Voltage Detection (PVD) with voltage settings
● Watchdog Timer (WDT)
● Independent Watchdog Timer (IWDT)
■ Human Machine Interface (HMI)
● Graphics LCD Controller (GLCDC)
● 2D Drawing Engine (DRW)
● Capture Engine Unit (CEU)
● MIPI DSI
■ Multiple Clock Sources
● Main clock oscillator (MOSC) (8 to 48 MHz)
● Sub-clock oscillator (SOSC) (32.768 kHz)
● High-speed on-chip oscillator (HOCO) (16/18/20/32/48 MHz)
● Middle-speed on-chip oscillator (MOCO) (8 MHz)
● Low-speed on-chip oscillator (LOCO) (32.768 kHz)
● Clock trim function for HOCO/MOCO/LOCO
● PLL1/PLL2
● Clock out support
■ General-Purpose I/O Ports
● 5-V tolerance, open drain, input pull-up, switchable driving ability
■ Operating Voltage
● VCC: 1.68 to 3.6 V
● VCC2: 1.65 to 3.6 V
■ Operating Junction Temperature and Packages
● Tj = -40℃ to +125℃
– 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch)
– 224-pin BGA (13 mm × 13 mm, 0.8 mm pitch)




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A proposito di Renesas Technology Corp


Renesas Technology Corp è una società di semiconduttori giapponesi che fornisce una vasta gamma di microcontrollori, sistemi su chip e dispositivi analogici e di alimentazione per varie applicazioni nei mercati automobilistici, industriali e di consumo.
La società è stata formata nel 2010 attraverso la fusione di NEC Electronics Corporation e Renesas Technology Corporation.
Renesas è uno dei più grandi fornitori di microcontrollori al mondo ed è noto per la sua esperienza nello sviluppo di tecnologie avanzate in settori come l'Internet of Things (IoT), l'intelligenza artificiale (AI) e l'elettronica automobilistica.
La società ha operazioni in oltre 20 paesi e i suoi prodotti vengono utilizzati in una vasta gamma di applicazioni.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.




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