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CSD95372AQ5M Scheda tecnica (PDF) - Texas Instruments

CSD95372AQ5M Datasheet PDF - Texas Instruments
Il numero della parte CSD95372AQ5M
Scarica  CSD95372AQ5M Scarica
Grandezza file   712.42 Kbytes
Page   25 Pages
Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
Logo TI2 - Texas Instruments
Spiegazioni elettronici CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

CSD95372AQ5M Datasheet (PDF)

Go To PDF Page Scarica Scheda tecnica
CSD95372AQ5M Datasheet PDF - Texas Instruments

Il numero della parte CSD95372AQ5M
Scarica  CSD95372AQ5M Click to download

Grandezza file   712.42 Kbytes
Page   25 Pages
Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
Logo TI2 - Texas Instruments
Spiegazioni elettronici CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

CSD95372AQ5M Scheda tecnica (HTML) - Texas Instruments


CSD95372AQ5M Dettagli del prodotto

1 Features
1• 60 A Continuous Operating Current Capability
• 92.4% System Efficiency at 30 A
• Ultra-Low Power Loss of 3.3 W at 30 A
• High Frequency Operation (up to 2 MHz)
• High Density - SON 5 x 6 mm Footprint
• Ultra-Low Inductance Package
• System Optimized PCB Footprint
• 3.3 V and 5 V PWM Signal Compatible
• Diode Emulation Mode with FCCM
• Analog Temperature Output
• Input Voltages up to 16 V
• Tri-State PWM Input
• Integrated Bootstrap Switch
• Optimized Dead Time for Shoot Through
Protection
• RoHS Compliant – Lead-Free Terminal Plating
• Halogen Free

2 Applications
• Multiphase Synchronous Buck Converter
– High Frequency Applications
– High Current, Low Duty Cycle Applications
• Point-of-Load DC-DC Converters
• Memory and Graphic Cards
• Desktop and Server VR11.x and VR12.x for
V-Core Synchronous Buck Converters

3 Description
The CSD95372AQ5M NexFET™ Power Stage is a
highly optimized design for use in a high power, high
density Synchronous Buck converters. This product
integrates the driver IC and NexFET technology to
complete the power stage switching function. The driver IC has a built-in selectable diode emulation
function that enables DCM operation to improve light
load efficiency. This combination produces high
current, high efficiency, and high speed switching
capability in a small 5 x 6 mm outline package. It also integrates the temperature sensing functionality to
simplify system design and improve accuracy. In
addition, the PCB footprint has been optimized to
help reduce design time and simplify the completion
of the overall system design.




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