FEATURES
• Industry Standard Serial Interface
- IS25LE01GG: 1Gbit/128Mbyte
- IS25WE01GG: 1Gbit/128Mbyte
- 3 or 4 Byte Addressing Mode
- Supports Standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
- Software & Hardware Reset
- Supports Serial Flash Discoverable
Parameters (SFDP)
- Dedicated WP# as an option(3)
- 1-bit ERROR Detection and Correction
per 128-bit boundary (with ECC)
• High Performance Serial Flash (SPI)
- 66MHz Normal Read
- Up to166Mhz Fast Read (3.0V)
- Up to133Mhz Fast Read (1.8V)
- Up to 80MHz DTR (Dual Transfer Rate)
- Equivalent Throughput of 664 Mb/s
- Selectable Dummy Cycles
- Configurable Drive Strength
- Supports SPI Modes 0 and 3
- More than 100,000 Erase/Program Cycles
- More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
- Chip Erase with Uniform Sector/Block
Erase (4/32/64KB or 4/32/256 KB)(2)
- Program 1 to 256 or 512 Byte per Page(2)
- Program/Erase Suspend & Resume
• Efficient Read and Program modes
- Low Instruction Overhead Operations
- Continuous Read 8/16/32/64 Byte
Burst Wrap
- Selectable Burst Length
- Data Learning Pattern for training in DTR
operation
• Low Power with Wide Temp. Ranges
- Single Voltage Supply
IS25LE: 2.70V to 3.60V
IS25WE: 1.65V to 1.95V
- 24 mA Active Read Current
- 60 μA Standby Current
- 2 μA Deep Power Down
- Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A2): -40°C to +105°C
-
• Advanced Security Protection
- Software and Hardware Write Protection
- Advanced Sector/Block Protection
- Top/Bottom Block Protection
- 4x512 Byte Dedicated Security Area
with OTP User-lockable Bits
- 128 bit Unique ID for Each Device
(Call Factory)
• Industry Standard Pin-out & Packages(1)
- M =16-pin SOIC 300mil
- L = 8-contact WSON 8x6mm
- G = 24-ball TFBGA 6x8mm (4x6 ball array)
- H = 24-ball TFBGA 6x8mm (5x5 ball array)
- Green Package (RoHS Compliant,
Halogen-Free) and TSCA Compliant