Features
■ Optimizes use of PC board space
■ High temperature dielectric
■ “No lead” wave and reflow solder compatible
■ Single- and dual row design, 3–40 pins or
■ 4–80 pins
■ Mates with pin-strip header products
■ See the Regulatory Information Appendix (RIA) in the “RoHS compliance” section of www.3M.com/interconnects for compliance information Date Modified: April 24, 2012 TS-2164-D Sheet 1 of 2 Physical Insulation Material: High Temperature Thermo­plastic Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 1.25–2.5 µm [100 µ’’] Nickel Wiping Area: 0.25 µm [10 µ’’] Gold Solder Tail Area: 1–3 µm [40–118 µ’’] Matte Tin