■ Features

● High density placing for digital signal circuits

· Bussed 8 or 15 resistors for pull up/down circuits

EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch

EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch

EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch

EXBQ: 3.8 mm × 1.6 mm × 0.45 mm, 0.5 mm pitch

· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB

(“High density placing” is shown below)

● High speed mounting using conventional placing machine

● Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130

● RoHS compliant