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0015800325 Scheda tecnica (PDF) - Molex Electronics Ltd.

Il numero della parte	0015800325

Spiegazioni elettronici	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

Grandezza file	1229.88 Kbytes

Html View	1 2 3 4 5 6 7

Produttore elettronici	MOLEX2 [Molex Electronics Ltd.]

Homepage	http://www.molex.com

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0015800325 Scheda tecnica (PDF) - Molex Electronics Ltd.

Codice articolo simile - 0015800325

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
Molex Electronics Ltd.	0015800325	33Kb / 2P	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

Descrizione simile - 0015800325

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
Molex Electronics Ltd.	0015800705	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015800665	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015801201	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015800585	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015801121	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015801501	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015800305	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015800265	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015801221	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015477732	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

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