| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Molex Electronics Ltd. |
0879144405
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879143435
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
0879143205
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879144204
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879110407
|
498Kb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
0879142815
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879141001
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879114211
|
372Kb / 6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879140001
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0878910204
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
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