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0877593064 Scheda tecnica (PDF) - Molex Electronics Ltd.

Il numero della parte	0877593064

Spiegazioni elettronici	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

Grandezza file	432.44 Kbytes

Html View	1 2 3 4 5 6 7 8

Produttore elettronici	MOLEX10 [Molex Electronics Ltd.]

Homepage	http://www.molex.com

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0877593064 Scheda tecnica (PDF) - Molex Electronics Ltd.

Codice articolo simile - 0877593064

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
Molex Electronics Ltd.	0877593065	292Kb / 6P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
Molex Electronics Ltd.	0877593066	310Kb / 6P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

Descrizione simile - 0877593064

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
Molex Electronics Ltd.	0877590465	292Kb / 6P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
	0877590474	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877593074	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877592674	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877594074	431Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877592474	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877594274	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
	0877594474	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap
	0877593274	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap
	0877593864	432Kb / 8P	2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

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