| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 Aavid, Thermal Division... |
573100D00000
|
85Kb / 2P |
For use with Surface Mount packages
2/25/2003 |
|
573300D00010
|
89Kb / 2P |
For use with Surface Mount packages
2/25/2003 |
|
573400D00010
|
92Kb / 2P |
For use with Surface Mount packages
2/25/2003 |
 M/A-COM Technology Solu... |
M538
|
748Kb / 8P |
Surface Mounting Instructions
|
 ACCUTEK MICROCIRCUIT CO... |
AK08D300-LLP
|
1Mb / 9P |
Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters
|
 AVAGO TECHNOLOGIES LIMI... |
HSMS-2810
|
457Kb / 10P |
Surface Mount RF Schottky Barrier Diodes Surface Mount Packages
|
|
HSMP-3863-TR1G
|
356Kb / 10P |
Unique Configurations in Surface Mount Packages
|
 ACCUTEK MICROCIRCUIT CO... |
AK08D300-LLP3X3
|
1Mb / 9P |
Chip Scale Packages LLP, DFN, QFN MLP, LCC DIP Adapters
|
 AVAGO TECHNOLOGIES LIMI... |
HSMP-3864-BLKG
|
273Kb / 10P |
Unique Configurations in Surface Mount Packages
|
 STMicroelectronics |
TN1198
|
140Kb / 10P |
Surface mount guidelines for MEMS sensors in HLGA packages
05-Dec-2014 |