| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 fujitsu semiconductor |
FPT-64P-M09
|
58Kb / 1P |
LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC
|
 NXP Semiconductors |
SOT389-1
|
14Kb / 1P |
Plastic Low Profile Quad flat Package
2002 Jun 07 |
 fujitsu semiconductor |
FPT-208P-M06
|
57Kb / 1P |
LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC
|
 NXP Semiconductors |
SOT545-3
|
15Kb / 1P |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
2004 Feb 05 |
 ILSI America LLC |
IL3R
|
46Kb / 2P |
4 Pad Plastic Package, 1.4 mm x 7 mm
|
 List of Unclassifed Man... |
AFB0912HD
|
122Kb / 1P |
92 x 92 x 20 MM SERIES
|
|
AFB0512VHD
|
169Kb / 1P |
50 x 50 x 20 MM SERIES
|
 NXP Semiconductors |
SOT612-3
|
850Kb / 5P |
plastic thermal enhanced low profile quad flat package
8 February 2016 |
|
SOT612-4
|
849Kb / 5P |
plastic thermal enhanced low profile quad flat package
8 February 2016 |
|
NAFE11388
|
226Kb / 7P |
thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body
Rev. 1-29 December 2021 |