| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 Micropac Industries |
61059
|
89Kb / 3P |
Suitable for high-density PC Board mounting
|
 Shanghai Leiditech Elec... |
BZT52C3V3
|
895Kb / 3P |
Small package size suitable for high-density applications
|
|
BZT52C56
|
895Kb / 3P |
Small package size suitable for high-density applications
|
|
BZT52C62
|
895Kb / 3P |
Small package size suitable for high-density applications
|
|
BZT52C82
|
912Kb / 3P |
Small package size suitable for high-density applications
|
 EHAOAN. |
EH-2835S850-20120
|
2Mb / 9P |
Suitable for SMT assembly
|
|
EH-3535A940-A120
|
2Mb / 9P |
Suitable for SMT assembly
|
|
EH-3020IR-A60
|
2Mb / 9P |
Suitable for SMT assembly
|
|
EH-3020IR-A80
|
2Mb / 9P |
Suitable for SMT assembly
|
|
EH-3216IR-A60
|
4Mb / 9P |
Suitable for SMT assembly
|