| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Sony Corporation |
CXG1047FN
|
104Kb / 9P |
Dual-Band 3V Power Amplifier for GSM900/DCS1800 Applications
|
Analog Devices |
AD20MSP415
|
66Kb / 8P |
GSM/DCS1800/PCS1900 Baseband Processing Chipset
|
Maxim Integrated Produc... |
MAX2651
|
466Kb / 16P |
GSM900 and DCS1800/PCS1900 Dual-Band, Low-Noise Amplifiers
19-1506; Rev 1; 10/99 |
Mitsubishi Electric Sem... |
BA01303
|
88Kb / 3P |
Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
|
Skyworks Solutions Inc. |
RM008
|
507Kb / 12P |
PA Module for Dual-band GSM900 and DCS1800 Applications
|
|
RM009
|
296Kb / 17P |
Power Amplifier Module for Dual-band GSM900 DCS1800
|
RF Micro Devices |
RF4180
|
124Kb / 2P |
DUAL-BAND GSM900/DCS1800 TRANSMIT MODULE
|
|
RF3283
|
296Kb / 16P |
DUAL-BAND GSM900/DCS1800 TRANSMIT MODULE
|
Texas Instruments |
LMX2604
|
312Kb / 15P |
Triple-band VCO
|
RF Micro Devices |
RF7161
|
871Kb / 20P |
QUAD-BAND GSM850/EGSM900/DCS1800/PCS1900 TRANSMIT MODULEThe
|
Italian ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand