TPCL/TA series

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DESCRIPTION：

TPCL/Ta series is applies to the analog circuit is more sensitive to noise and EMC . After adding a

Cmmon Mode Flitter on the input terminal , can substantially reduce the port noise and it can

substantially improve the EMS performance.

EMC Cmmon Mode Flitter

All specifications typical at TA=25

°C, nominal input voltage and rated output current unless otherwise specified.

MECHANICAL DIMENSIONS1

FEATURES

Good temperature characteristic

Miniature styles

Meet UL508 isolation require

Suitable for analog circuits

RoHS compliant

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SELECTION GUIDE

Part Number

Inductance

(μH)(typ)

Current (A)(max)

DCR(m

Ω)(max)

Weight(g)

(typ.)

Size(L*W*H)

TPCL/TA--0.5-10000

10000*2

0.5

500*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--0.5-15000

15000*2

0.5

600*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--0.5-22000

22000*2

0.5

650*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--1.0-1000

1000*2

1.0

70*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--1.0-2200

2200*2

1.0

90*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--1.0-3300

3300*2

1.0

100*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--1.0-4700

4700*2

1.0

140*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--3.0-1000

1000*2

3.0

40*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--3.0-2200

2200*2

3.0

50*2

4.5

Refer to mechanical dimensions 1

TPCL/TA--3.0-4700

4700*2

3.0

70**2

4.5

Refer to mechanical dimensions 1

TPCL/TA--1.0-6800

6800*2

1.0

160*2

6.5

Refer to mechanical dimensions 2

TPCL/TA--1.0-8200

8200*2

1.0

180*2

6.5

Refer to mechanical dimensions 2

NOTES

1、 the maximum temperature can not exceed the specified value While operating

2、 the maximum working environment temperature is variable, cooling conditions and the actual use of power changes will affect the maximum working temperature.

3、 This series products is high-power density, more heat dissipation & cooling area limited, it is recommended to use auxiliary cooling measures (plus radiators, metal

equipment attached to the wall, etc.) to ensure that the substrate temperature does not exceed the specified value while full load operating under high temperaturer

envirnment.