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TLV70518YFPR Scheda tecnica(PDF) 30 Page - Texas Instruments |
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TLV70518YFPR Scheda tecnica(HTML) 30 Page - Texas Instruments |
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30 / 36 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 4X ( 0.23) (0.4) TYP (0.4) TYP ( 0.23) METAL 0.05 MAX SOLDER MASK OPENING METAL UNDER SOLDER MASK ( 0.23) SOLDER MASK OPENING 0.05 MIN 4223507/A 01/2017 DSBGA - 0.5 mm max height YFP0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:50X A B 1 2 NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK DEFINED EXPOSED METAL |
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