SPWF04SA datasheet(19/27 Pages) STMICROELECTRONICS

Il numero della parte	SPWF04SA

Spiegazioni elettronici	Standalone and Serial-to-Wi-Fi b/g/n intelligent modules

PDF	27 Pages

Scroll/Zoom	100%

Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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19 / 27 page

SPWF04SA, SPWF04SC

Module reflow

DocID029757 Rev 5

19/27

Module reflow

The SPWF04SA and SPWF04SC are surface mount modules with a 6-layer PCB. The

recommended final assembly reflow profiles are indicated below.

The soldering phase must be executed with care: in order to prevent an undesired melting

phenomenon, particular attention must be paid to the setup of the peak temperature.

The following are some suggestions for the temperature profile based on the IPC/JEDEC J-

STD-020C, July 2004 recommendations.

Table 8: Soldering values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to TP)

3 °C/sec max

Preheat:

Temperature min. (Ts min.)

Temperature max. (Ts max.)

Time (Ts min. to Ts max) (ts)

150 °C

200 °C

60 - 100 sec

Critical zone:

Temperature TL

Time TL

217 °C

60 - 70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature

(TP)

10 - 20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.

Figure 9: Soldering profile

SPWF04SA Scheda tecnica(PDF) 19 Page - STMicroelectronics