© 2016 Semiconductor Components Industries, LLC.

www.fairchildsemi.com

FDMF3039 • Rev. 2

21

www.onsemi.com

Land Pattern Recommendation

Figure 35.

22-Lead, Clip Bond PQFN SPS, 3.5 mm x 4.5 mm Package Land Pattern Recommendation

NOTES: UNLESS OTHERWISE SPECIFIED

A) DOES NOT FULLY CONFORM TO JEDEC

REGISTRATION MO-220, ISSUE K.01, DATED

AUG. 2011.

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE BURRS

OR MOLD FLASH. MOLD FLASH OR

BURRS DOES NOT EXCEED 0.10MM.

D) DIMENSIONING AND TOLERANCING PER

ASME Y14.5M-2009.

E) DRAWING FILE NAME: MKT-PQFN22AREV1

0.500

C.L.

C.L.

LAND PATTERN RECOMMENDATION

SCALE 2:1

0.500

0.300 (22X)

1.000

0.500

1.000

1.500

1.825

2.075

2.400

1.500

1.000

0.500

1.000

1.500

2.400

1.875

0.095

1.500

15

14

13

12

16

2

3

4

51

0.000

6

7

8

1.495

0.375

0.375

0.725

1.475

22

21

20

23