FDMF6704 datasheet(2/16 Pages) ONSEMI

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www.fairchildsemi.com

FDMF6704 Rev. G

August 2009

FDMF6704 - XSTM DrMOS

The Xtra Small, High Performance, High Frequency DrMOS Module

Benefits

Ultra compact size - 6 mm x 6 mm MLP, 44 % space

saving compared to conventional MLP 8 mm x 8 mm

DrMOS packages.

Fully optimized system efficiency.

Clean voltage waveforms with reduced ringing.

High frequency operation.

Compatible with a wide variety of PWM controllers in the

market.

Features

Ultra- compact thermally enhanced 6 mm x 6 mm MLP

package 84 % smaller than conventional discrete solutions.

Synchronous driver plus FET multichip module.

High current handling of 35 A.

Over 93 % peak efficiency.

Tri-State PWM input.

Fairchild's PowerTrench® 5 technology MOSFETs for clean

voltage waveforms and reduced ringing.

Optimized for high switching frequencies of up to 1 MHz.

Skip mode SMOD [low side gate turn off] input.

Fairchild SyncFETTM [integrated Schottky diode] technology

in the low side MOSFET.

Integrated bootstrap Schottky diode.

Adaptive gate drive timing for shoot-through protection.

Driver output disable function [DISB# pin].

Undervoltage lockout (UVLO).

Fairchild Green Packaging and RoHS

compliant. Low profile SMD package.

General Description

The XSTM DrMOS family is Fairchild’s next-generation fully-

optimized, ultra-compact, integrated MOSFET plus driver power

stage solutions for high current, high frequency synchronous

buck DC-DC applications. The FDMF6704 XSTM DrMOS

integrates a driver IC, two power MOSFETs and a bootstrap

Schottky diode into a thermally enhanced, ultra compact 6 mm x

6 mm MLP package. With an integrated approach, the complete

switching power stage is optimized with regards to driver and

MOSFET dynamic performance, system inductance and

RDS(ON). This greatly reduces the package parasitics and layout

challenges associated with conventional discrete solutions.

XSTM

DrMOS

uses

Fairchild's

high

performance

PowerTrenchTM 5 MOSFET technology, which dramatically

reduces ringing in synchronous buck converter applications.

PowerTrenchTM 5 can eliminate the need for a snubber circuit in

buck converter applications. The driver IC incorporates

advanced features such as SMOD for improved light load

efficiency and a Tri-State PWM input for compatibility with a

wide range of PWM controllers. A 5 V gate drive and an

improved PCB interface optimized for a maximum low side FET

exposed pad area, ensure higher performance. This product is

compatible with the new Intel 6 mm x 6 mm DrMOS

specification.

Applications

Compact blade servers V-core, non V-core and VTT DC-DC

converters.

Desktop computers V-core, non V-core and VTT DC-DC

converters.

Workstations V-core, non V-core and VTT DC-DC

converters.

Gaming Motherboards V-core, non V-core and VTT DC-DC

converters.

Gaming consoles.

High-current DC-DC Point of Load (POL) converters.

Networking and telecom microprocessor voltage regulators.

Power Train Application Circuit

Figure 1. Power Train Application Circuit

DISB#

PWM

CGND PGND

VCIN

VIN

BOOT

VSWH

DISB#

PWM Input

CVIN

12 V

CBOOT

COUT

OUTPUT

5 V

CVDRV

VDRV

SMOD#

OFF

PHASE

Ordering Information

Order Number

Marking

Temperature Range

Device Package

Packing Method

Quantity

FDMF6704

FDMF6704_1

-55 °C to 150 °C

40 Pin, 3 DAP, MLP 6x6 mm

Tape and Reel

3000

LOUT

RBOOT

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