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SP1007 Scheda tecnica(PDF) 5 Page - Littelfuse |
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SP1007 Scheda tecnica(HTML) 5 Page - Littelfuse |
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5 / 5 page ![]() © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA®Diodes) General Purpose ESD Protection - SP1007 Series Embossed Carrier Tape & Reel Specification — SOD882 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10 Embossed Carrier Tape & Reel Specification — 0201 Flipchip 0.28 0.30 0.75 0.19 Recommended Solder Pad Footprint A0 K0 B0 T P0 P1 P2 D D1 E F W *Sizes in mm Symbol Millimeters A0 0.41±0.03 B0 0.70±0.03 D ø 1.50 + 0.10 D1 ø 0.20 ± 0.05 E 1.75±0.10 F 3.50±0.05 K0 0.38±0.03 P0 2.00±0.05 P1 2.00±0.05 P2 4.00±0.10 W 8.00 + 0.30 -0.10 T 0.23±0.02 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. |
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