AD7760

Preliminary Technical Data

Rev. PrN | Page 22 of 22

OUTLINE DIMENSIONS

1

12

13

24

25

36

37

48

BOTTOM

VIEW

7.0 (0.276) BSC SQ

5.25 (0.207)

5.10 (0.201) SQ

4.95 (0.195)

0.60 (0.024)

0.42 (0.017)

0.24 (0.009)

0.50 (0.020)

0.40 (0.016)

0.30 (0.012)

PIN 1

INDICATOR

TOP

VIEW

6.75 (0.266)

BSC SQ

5.5 (0.217)

REF

0.25 (0.010)

MIN

0.60 (0.024)

0.42 (0.017)

0.24 (0.009)

0.70 (0.028) MAX

0.65 (0.026) NOM

0.05 (0.002)

0.01 (0.0004)

0.0 (0.0)

0.20 (0.008)

REF

0.50 (0.020)

BSC

12°MAX

0.90 (0.035) MAX

0.85 (0.033) NOM

0.30 (0.012)

0.23 (0.009)

0.18 (0.007)

Figure 21. 48-Lead Frame Chip Scale Package [LFCSP] (CP-48)—Dimensions shown in millimeters

1

16

17

33

32

48

49

64

12.0(0.47) BSC

10.0(0.39) BSC

0.50 (0.02)

BSC

0.22 ± 0.05

(0.0087 ± 0.002)

SEATING

PLANE

1.60 (0.063) MAX

0.60 ± 0.15

(0.024 ± 0.006)

TYP

0.15(0.006)

0.05(0.002)

TOP VIEW

6.0(0.235)

BSC

Figure 22. 64-Lead Thin Quad Flat Pack (Exposed Paddle) [TQFP] (SV-64)—Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD7760BCP

–40°C to +85°C

Lead Frame Chip Scale Package

CP-48

AD7760BSV

–40°C to +85°C

Thin Quad Flat Pack, Exposed Paddle

SV-64

© 2004 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

Printed in the U.S.A.

PR04975-0-6/04(PrN)