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LCYCLBP Scheda tecnica(PDF) 13 Page - OSRAM GmbH |
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LCYCLBP Scheda tecnica(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page ![]() Version 1.8 LCY CLBP 2018-02-27 13 Recommended Solder Pad 8) page 21 Reflow soldering Empfohlenes Lötpaddesign 8) Seite 21 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. _ Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. _ Das Gehäuse ist für Ultraschallreinigung nicht geeignet. |
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