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LAM676 Scheda tecnica(PDF) 11 Page - OSRAM GmbH |
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LAM676 Scheda tecnica(HTML) 11 Page - OSRAM GmbH |
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11 / 21 page ![]() LA M676 11 Version 1.4 | 2018-04-16 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) |
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