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S29AS008J Scheda tecnica(PDF) 6 Page - Cypress Semiconductor |
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S29AS008J Scheda tecnica(HTML) 6 Page - Cypress Semiconductor |
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6 / 56 page ![]() Document Number: 002-00870 Rev.*K Page 6 of 56 S29AS008J 3.2 FBGA Connection Diagram 3.3 Special Handling Instructions Special handling is required for Flash Memory products in BGA packages. Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. A1 B1 C1 D1 E1 F1 G1 H1 A2 B2 C2 D2 E2 F2 G2 H2 A3 B3 C3 D3 E3 F3 G3 H3 A4 B4 C4 D4 E4 F4 G4 H4 A5 B5 C5 D5 E5 F5 G5 H5 A6 B6 C6 D6 E6 F6 G6 H6 DQ15/A-1 VSS BYTE# A16 A15 A14 A12 A13 DQ13 DQ6 DQ14 DQ7 A11 A10 A8 A9 VCC DQ4 DQ12 DQ5 NC NC RESET# WE# DQ11 DQ3 DQ10 DQ2 NC A18 WP# RY/BY# DQ9 DQ1 DQ8 DQ0 A5 A6 A17 A7 OE# VSS CE# A0 A1 A2 A4 A3 Fine-pitch Ball Grid Array |
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