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LRY8SF Scheda tecnica(PDF) 12 Page - OSRAM GmbH |
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LRY8SF Scheda tecnica(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page ![]() LR Y8SF 12 Version 1.3 | 2018-02-12 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHPY1315 0.8 (0.031) Component location on pad Bauteil positioniert Padgeometrie für CA verbesserte Wärmeableitung heat dissipation Paddesign for improved Lötstopplack Solder resist C A |
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