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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LRH9PP Scheda tecnica(PDF) 13 Page - OSRAM GmbH |
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LRH9PP Scheda tecnica(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page  Version 1.7 LR H9PP 2016-11-09 13 Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. In case the PCB layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat sink must not be electrically connected to anode- or cathode solder pad because of possible chip inverted polarity. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Sollte das Leiterplattenlayout auch für weitere OSLON Derivate oder zukünftige OSLON Derivate einsetzbar sein, muss die Wärmesenke auf der Leiterplatte elektrisch gegen den Anoden- und Kathodenanschluss isoliert sein, um Varianten mit möglicherweise invertiertem Chip einsetzen zu können. |
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