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MP158GS Scheda tecnica(PDF) 3 Page - Monolithic Power Systems |
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MP158GS Scheda tecnica(HTML) 3 Page - Monolithic Power Systems |
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3 / 20 page ![]() MP158 –SMALL, ENERGY-EFFICIENT, OFF-LINE REGULATOR MP158 Rev. 1.0 www.MonolithicPower.com 3 10/17/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. PACKAGE REFERENCE TOP VIEW TOP VIEW 1 2 3 5 4 SOURCE SOURCE VCC FB DRAIN VCC FB SOURCE SOURCE N/C DRAIN N/C N/C 1 2 3 4 8 7 6 5 TSOT23-5 SOIC-8 ABSOLUTE MAXIMUM RATINGS (1) Drain to source ............................ -0.3V to 500V All other pins................................. -0.3V to 6.5V Continuous Power Dissipation ... (TA = +25°C) (2) TSOT23-5.....................................................1W SOIC8...........................................................1W Junction Temperature.............................. 150°C Lead Temperature ................................... 260°C Storage Temperature............... -60°C to +150°C ESD Capability Human Body Mode ..........3.5kV ESD Charged Device Model TSOT23-5...............................................1.75kV SOIC8.......................................................2.0kV Recommended Operating Conditions (3) Operating Junction Temp. (TJ). -40°C to +125°C Operating VCC range .................... 5.3V to 5.6V Thermal Resistance (4) θJA θJC TSOT23-5 ............................. 100 ..... 55... °C/W SOIC-8................................... 96 ...... 45... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowance continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-TA)/θJA. Exceeding the maximum allowance power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuit protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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