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OPA858 Scheda tecnica(PDF) 4 Page - Texas Instruments |
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OPA858 Scheda tecnica(HTML) 4 Page - Texas Instruments |
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4 / 28 page ![]() 4 OPA858 SBOS629 – APRIL 2018 www.ti.com Product Folder Links: OPA858 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Specifications 6.1 Thermal Information THERMAL METRIC(1) OPA858 UNIT DSG (WSON) 8 PINS RθJA Junction-to-ambient thermal resistance 80.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 100 °C/W RθJB Junction-to-board thermal resistance 45 °C/W ψJT Junction-to-top characterization parameter 6.8 °C/W ψJB Junction-to-board characterization parameter 45.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 22.7 °C/W |
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