FDC6323L datasheet(2/7 Pages) ONSEMI

2 / 7 page

Electrical Characteristics (T

A = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OFF CHARACTERISTICS

Forward Leakage Current

IN = 8 V, VON/OFF = 0 V

µA

Reverse Leakage Current

IN = -8 V, VON/OFF = 0 V

-1

µA

ON CHARACTERISTICS (Note 3)

Input Voltage

ON/OFF

On/Off Voltage

1.5

DROP

Conduction Voltage Drop @ 1A

IN = 5 V, VON/OFF = 3.3 V

0.145

0.2

IN = 3.3 V, VON/OFF = 3.3 V

0.178

0.3

Load Current

DROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V

DROP = 0.3 V, VIN = 3.3 V, VON/OFF = 3.3 V

Notes:

1. V

IN=8V, VON/OFF=8V, VDROP=0.5V, TA=25

2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed

by design while RθCA is determined by the user's board design.

(t) = TJ−TA

θJ A(t) =

−T

θJ C+RθCA(t) =

I D

(t) × R

(ON)@T

Typical RθJA for single device operation using the board layouts shown below on FR-4 PCB in a still air environment:

a. 180

oC/W when mounted on a 2oz minimum copper pad.

Scale 1 : 1 on letter size paper

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDC6323L Scheda tecnica(PDF) 2 Page - ON Semiconductor

FDC6323L Scheda tecnica(HTML) 2 Page - ON Semiconductor

Html Pages

1 2 3 4 5 6 7

Scheda tecnica Scarica

Link URL