ADCMP606 datasheet(7/14 Pages) AD

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Data Sheet

ADCMP606/ADCMP607

Rev. C | Page 7 of 14

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

VEE 2

VP 3

VCCI/VCCO

ADCMP606

TOP VIEW

(Not to Scale)

Figure 3. ADCMP606 Pin Configuration

Table 5. ADCMP606 (6-Lead SC70) Pin Function Descriptions

Pin No.

Mnemonic

Description

Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than

the analog voltage at the inverting input, VN.

VEE

Negative Supply Voltage.

Noninverting Analog Input.

Inverting Analog Input.

VCCI/VCCO

Input Section Supply/Output Section Supply. Shared pin.

Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the

analog voltage at the inverting input, VIN.

VCCO

VCCI

VEE

LE/HYS

SDN

ADCMP607

TOP VIEW

NOTES

1. EXPOSED PAD. IF CONNECTED, THE EPAD MUST BE CONNECTED TO VEE.

THE METALLIC BACK SURFACE OF THE PACKAGE IS ELECTRICALLY

CONNECTED TO VEE. IT CAN BE LEFT FLOATING BECAUSE PIN 3, PIN 5,

PIN 9, AND PIN 11 PROVIDE ADEQUATE ELECTRICAL CONNECTION. IT CAN

ALSO BE SOLDERED TO THE APPLICATION BOARD IF IMPROVED THERMAL

AND/OR MECHANICAL STABILITY IS DESIRED.

Figure 4. ADCMP607 Pin Configuration

Table 6. ADCMP607 (12-Lead LFCSP) Pin Function Descriptions

Pin No.

Mnemonic

Description

VCCO

Output Section Supply.

VCCI

Input Section Supply.

3, 5, 9, 11

VEE

Negative Supply Voltage.

Noninverting Analog Input.

Inverting Analog Input.

SDN

Shutdown. Drive this pin low to shut down the device.

LE/HYS

Latch/Hysteresis Control. Bias with resistor or current for hysteresis adjustment; drive low to latch.

Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the

analog voltage at the inverting input, VN, if the comparator is in compare mode.

Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than

the analog voltage at the inverting input, VN, if the comparator is in compare mode.

EPAD

Exposed Pad. If connected, the EPAD must be connected to VEE. The metallic back surface of the package

is electrically connected to VEE. It can be left floating because Pin 3, Pin 5, Pin 9, and Pin 11 provide

adequate electrical connection. It can also be soldered to the application board if improved thermal

and/or mechanical stability is desired.

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