Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Dec., 2012

APW7237

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VIN Pin to GND

-0.3 to 7

V

LX Pin to GND

-0.3 to 22

V

EN Pin to GND

V

Maximum Junction Temperature

150

°C

Storage Temperature Range

-65 to 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

TSOT-23-5A

220

θ

JA

Junction-to-Ambient Resistance in free air (Note 2)

TDFN2x2-6

165

TSOT-23-5A

120

θ

JC

Junction-to-Case Resistance

TDFN2x2-6

20

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Note 2:

θ

APW7237

Handling Code

Temperature Range

Package Code

Assembly Material

APW7237BT:

X - Date Code

W37X

APW7237QB:

X - Date Code

W37

X

Package Code

BT : 5 Lead TSOT-23

QB: TDFN2x2-6

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device