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ICS2309 Scheda tecnica(PDF) 6 Page - Integrated Circuit Systems |
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ICS2309 Scheda tecnica(HTML) 6 Page - Integrated Circuit Systems |
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6 / 9 page ![]() 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER MDS 2309 D 6 Revision 052405 In te gr ated Circuit Systems ● 5 25 Race Stree t, San Jose, CA 951 26 ● te l (40 8) 2 97-12 01 ● www.icst.com ICS2309 Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch) Package dimensions are kept current with JEDEC Publication No. 95 Thermal Characteristics for 16TSSOP Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θ JA Still air 78 °C/W θ JA 1 m/s air flow 70 °C/W θ JA 3 m/s air flow 68 °C/W Thermal Resistance Junction to Case θ JC 37 °C/W INDEX AREA 1 2 16 D E1 E SEATING PLANE A 1 A A 2 e - C - b .10 (.004) C c L Millimeters Inches Symbol Min Max Min Max A -- 1.20 -- 0.047 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.032 0.041 b 0.19 0.30 0.007 0.012 C 0.09 0.20 0.0035 0.008 D 4.90 5.1 0.193 0.201 E 6.40 BASIC 0.252 BASIC E1 4.30 4.50 0.169 0.177 e 0.65 Basic 0.0256 Basic L 0.45 0.75 0.018 0.030 α 0 ° 8 ° 0 ° 8 ° |
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