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PDIP24 Scheda tecnica(PDF) 1 Page - STMicroelectronics |
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PDIP24 Scheda tecnica(HTML) 1 Page - STMicroelectronics |
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1 / 2 page ![]() POWER DIP 24 20+2+2 leads PACKAGE MATERIAL LIST Thermal Data 24 leads November 2000 1/2 Charts enclosed : 1) Rth(j-a) vs on board heat sink 2) Zth(j-a) vs time width item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue (silver filled) 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
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