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ML66517 Scheda tecnica(PDF) 26 Page - OKI electronic componets |
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ML66517 Scheda tecnica(HTML) 26 Page - OKI electronic componets |
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26 / 28 page ![]() PEDL66517-03 1Semiconductor ML66517 Family 26/28 QFP64-P-1414-0.80-BK Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 m or more 0.87 TYP. (Unit : mm) MIRROR FINISH Notes for Mounting the Surface Mount Type Packages The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). |
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