HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HI200201

Issued Date : 2002.02.01

Revised Date : 2005.07.13

Page No. : 3/4

HSB1386I

HSMC Product Specification

TO-251 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

a1

A

F

G

a2

K1

K

3

2

1

C

a1

M

L

Tab

H1

a2

A

B

C

D

E

a1

F

G

H

H1

K

J

a2

a2

K1

y2

y2

M

a1

y1

a1

y1

y1

I

Marking:

Control Code

Date Code

HB

13

Pb Free Mark

Pb-Free: "

Normal: None

8

S

6I

Note: Green label is used for pb-free packing

Pin Style: 1.Base 2/Tab.Collector 3.Emitter

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-251

Plastic Package

HSMC Package Code: I

DIM

Min.

Max.

A

6.35

6.80

C

4.80

5.50

F

1.30

1.70

G

5.40

6.25

H1

6.75

8.00

K

0.50

0.90

K1

0.40

0.90

L

0.90

1.50

M

2.20

2.40

a1

0.40

0.65

a2

-

*2.30

*: Typical, Unit: mm

3-Lead TO-251

Plastic Package

HSMC Package Code: I

Marking:

Control Code

Date Code

HB

13

Pb Free Mark

Pb-Free: "

Normal: None

8

S

I

6

Note: Green label is used for pb-free packing

Pin Style: 1.Base 2.Collector 3.Emitter

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

6.40

6.80

B

-

6.00

C

5.04

5.64

D-

*4.34

E

0.40

0.80

F

0.50

0.90

G

5.90

6.30

H-

*1.80

H1

-

*9.30

I

-

*16.10

J-

*0.80

K

-

0.96

K1

-

*0.76

M

2.20

2.40

a1

0.40

0.60

a2

2.10

2.50

y1

-

y2

-

*: Typical, Unit: mm