RS3MFS

Taiwan Semiconductor

2

Version:A1703

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

23

°C/W

Junction-to-ambient thermal resistance

88

°C/W

Junction-to-case thermal resistance

24

°C/W

Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

1.10

1.21

V

1.20

1.30

V

0.90

1.00

V

1.03

1.20

V

(2)

-

5

μA

-

250

μA

Junction capacitance

15

-

pF

Reverse recovery time

-

160

ns

Notes:

1. Pulse test with PW=0.3 ms

2. Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

RS3MFS

(Note 1)

H

MW

G

SOD-128

3,500 / 7" Plastic reel

MX

SOD-128

14,000 / 13" Plastic reel

Note:

1. Whole series with green compound (halogen-free)

EXAMPLE P/N

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

RS3MFSHMWG

RS3MFS

H

MW

G

AEC-Q101 qualified

Green compound