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HSDL-3003 Scheda tecnica(PDF) 14 Page - Agilent(Hewlett-Packard)

Il numero della parte HSDL-3003
Spiegazioni elettronici  IrDA Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver
PDF  21 Pages
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Produttore elettronici  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-3003 Scheda tecnica(HTML) 14 Page - Agilent(Hewlett-Packard)

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14
Figure 18. Solder stencil aperture.
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern.
Aperture size(mm)
Stencil thickness, t (mm)
length, l
width, w
0.152 mm
2.60
± 0.05
0.55
± 0.05
0.127 mm
3.00
± 0.05
0.55
± 0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keepout is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is 0.2
mm.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 19. Adjacent land keepout and solder mask areas.
APERTURES AS PER
LAND DIMENSIONS
l
w
t
0.2
3.0
10.1
3.85
SOLDER MASK
UNITS: mm



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