DAC08CSZ datasheet(5/21 Pages) AD

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Data Sheet

DAC08

Rev. D | Page 5 of 21

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Operating Temperature

DAC08AQ, DAC08Q

−55°C to +125°C

DAC08HQ, DAC08EQ, DAC08CQ

0°C to +70°C

DAC08CP, DAC08CS

−40°C to +85°C

Junction Temperature (TJ)

−65°C to +150°C

Storage Temperature Q Package

−65°C to +150°C

Storage Temperature P Package

−65°C to +125°C

Lead Temperature (Soldering, 60 sec)

300°C

V+ Supply to V− Supply

36 V

Logic Inputs

V− to V− + 36 V

VLC

V− to V+

Analog Current Outputs (at VS− = 15 V)

4.25 mA

Reference Input (V14 to V15)

V− to V+

Reference Input Differential Voltage

(V14 to V15)

±18 V

Reference Input Current (I14)

5.0 mA

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for worst case mounting conditions, that is, θJA is

specified for device in socket for CERDIP, PDIP, and LCC

packages; θJA is specified for device soldered to printed circuit

board for SOIC package.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

16-Lead CERDIP (Q)

100

°C/W

16-Lead PDIP (P)

°C/W

20-Terminal LCC (RC)

°C/W

16-Lead SOIC (S)

111

°C/W

ESD CAUTION

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