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OPA207

SBOS826A – DECEMBER 2017 – REVISED DECEMBER 2018

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Copyright © 2017–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input current must be limited to 10 mA.

(3)

Short circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, Vs = (V+) – (V–)

36

V

(V–) -0.7

(V+) +0.7

V

Input voltage - Differential

–1

1

V

Continuous

Operating temperature

–55

125

°C

Specified temperature

–40

125

°C

Junction temperature

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

2000

V

1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, Vs = (V+) – (V–)

4.5 (±2.25)

30 (±15)

36 (±18)

V

Specified temperature

–40

+125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package ThermalMetrics application

report.

6.4 Thermal Information

OPA207

UNIT

D (SOIC)

DBV (SOT-23)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

121.5

166.3

°C/W

Junction-to-case (top) thermal resistance

64.3

116.9

°C/W

Junction-to-board thermal resistance

65.0

63.2

°C/W

Junction-to-top characterization parameter

18.2

45

°C/W

Junction-to-board characterization parameter

64.3

62.9

°C/W