STV0974 datasheet(64/69 Pages) STMICROELECTRONICS

Il numero della parte	STV0974

Spiegazioni elettronici	Mobile Imaging DSP

PDF	69 Pages

Scroll/Zoom	100%

Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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STV0974

PCB layout guide lines for the STV0974 and VS6552

Normal good PCB design practice should be observed for the layout of the STV0974.

Power and ground planes should be used to supply power to STV0974.

The high speed subLVDS signal pairs (PCLKP,PCLKN) and (PDATAP,PDATAN) should be routed as

balanced transmissions lines with a characteristic balanced impedance of between 80 to 120

Ω.

The two traces in the signal pair should be routed together and should be matched in length to

within +/-3mm. The pairs of balanced line traces should be matched in length to within +/- 10mm.

To save components, 100

Ω termination resistors are embedded in the high speed subLVDS signal

pairs (PCLKP/PCLKN) and (PDATAP/PDATAN) of the STV0974.

All passive components for the STV0974 should be placed in close proximity to the device,

including the decoupling capacitors. The decoupling capacitors for the VS6552 should be placed

close to the sensor.

STV0974 Scheda tecnica(PDF) 64 Page - STMicroelectronics