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MSM66577 Scheda tecnica(PDF) 33 Page - OKI electronic componets |
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MSM66577 Scheda tecnica(HTML) 33 Page - OKI electronic componets |
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33 / 34 page ![]() PEDL66577-01 1Semiconductor MSM66577 Family 33/34 PACKAGE DIMENSIONS (Unit: mm) TQFP100-P-1414-0.50-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating ( ≥5µm) Package weight (g) 0.55 TYP. 5 Rev. No./Last Revised 4/Oct. 28, 1996 Notes for Mounting the Surface Mount Type Packages The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). |
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