LM3595 datasheet(4/11 Pages) NSC

4 / 11 page

Electrical Characteristics

(Notes 2, 8)

(Continued)

Limits in standard typeface and typical values apply for T

J =25

oC. Limits in boldface type apply over the operating junction

temperature range. Unless otherwise specified: V

IN = 5V, VOUTX = 3.6V, RSET = 8.25k

Ω, V(EN) = V

IN, V(BR-ON) = 0V

Symbol

Parameter

Conditions

Min

Typ

Max

Units

EN Pin Current (Note 9)

V(EN) = 1.5V

1.5

µA

V(EN) = 0V

BR-ON

BR-ON Pin Current

≤ V

BR-ON

≤ V

0µA

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation

of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see

the Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: Thermal shutdown circuitry protects the device from permanent damage.

Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin. MIL-STD-883 3015.7

Note 5: The operation rating for minimum input voltage, VMIN, is limited by VOUTX and IOUTX as dictated by headroom voltage. The equation, VMIN ≥ (VOUTX+VHR),

must be satisfied for the desired output current to be realized. For more information, see the section on Output Current Capability found in this datasheet.

Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 105˚C), the maximum power

dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA-MAX =TJ-MAX-OP -(θJA xPD-MAX).

Note 7: Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC

standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of thermal vias. The ground plane on the board

is 50mm x 50mm. Thickness of copper layers are 36µm/18µm/18µm/36µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22˚C, still air. Power

dissipation is 1W. The value of

θJA of the LM3595 in LLP-10 could fall in a range as wide as 50˚C/W to 150˚C/W (if not wider), depending on PWB material, layout,

and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation

issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Power Dissipation and PCB Layout

Considerations sections of this datasheet.

Note 8: All room temperature limits are 100% tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed by correlation

using standard Statistical Quality Control methods (SQC). All limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are not

guaranteed, but do represent the most likely norm.

Note 9: The EN pin has an internally connected 1M

Ω pull-down resistor

Block Diagram

20072203

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