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LD5525GL Scheda tecnica(PDF) 4 Page - Leadtrend Technology

Il numero della parte LD5525GL
Spiegazioni elettronici  Multi-Mode PWM Controller of Flyback with Integrated BNI/BNO and Protection
PDF  16 Pages
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Produttore elettronici  LEADTREND [Leadtrend Technology]
Homepage  https://www.leadtrend.com.tw/
Logo LEADTREND - Leadtrend Technology

LD5525GL Scheda tecnica(HTML) 4 Page - Leadtrend Technology

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LD5525
06/30/2015
4
Leadtrend Technology Corporation
www.leadtrend.com.tw
LD5525-DS-00 June 2015
Absolute Maximum Ratings
Supply Voltage VCC,
-0.3V ~ 30V
OUT
-0.3V ~ VCC
COMP, FB, CS
-0.3V ~ 7V
Operating Ambient Temperature
-20
C ~ 85C
Operating Junction Temperature
-40
C ~ 125C
Storage Temperature Range
-65
C ~ 150C
Package Thermal Resistance (SOT-26, θJA)
200
C/W
Package Thermal Resistance (DIP-8, θJA)
100
C/W
Power Dissipation (SOT-26, at Ambient Temperature = 85
C)
200mW
Power Dissipation (DIP-8, at Ambient Temperature = 85
C)
400mW
Lead temperature (Soldering, 10sec)
260
C
ESD Voltage Protection, Human Body Model
2.5 KV
ESD Voltage Protection, Machine Model
250 V
Gate Output Current
250mA/-500mA
Caution:
Stress exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stress above Recommended Operating Conditions may affect
device reliability
Recommended Operating Conditions
Item
Min.
Max.
Unit
Operating Ambient Temperature
-40
85
C
Operating Junction Temperature
-40
125
C
Supply VCC Voltage
8.0
26.5
V
VCC Capacitor
3.3
10
F
Start-up resistor Value (AC Side, Half Wave)
400K
2M
Comp Pin Capacitor
1
10
nF
CS Pin Capacitor Value
47
470
pF
Note:
1.
It
’s essential to connect VCC pin with a SMD ceramic capacitor (0.1
F ~ 0.47F) to
filter out the undesired switching noise for stable operation. This capacitor should be
placed close to IC pin as possible
2.
It
’s also essential to connect a capacitor to COMP to filter out the undesired switching
noise for stable operation.
3.
The small signal components should be placed close to IC pin as possible.



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